Production Wafer Probers
Our sophisticated Production Wafer Probers deliver fast, steady testing via manual, fully automated and dual-sided setups. Optimized for substrate sizes from 2" up to 300mm to accommodate full or partial wafers.
Each production system is engineered around a tailored controller framework—a sturdy, field-tested foundation featuring simple integration via TTL, GPIB (IEEE488.2) and RS232. Systems are fully customisable with manipulators, dark boxes, damping tables, operational software, chucks, optics and laser setups.
200mm – automatic production prober
Engineered for high-capacity testing tasks that demand specialized substrate handling. This 200mm fully automated system processes GaN, GaAs, saw frames, and ultra-thin wafers using parallel processing and cassette-to-cassette mechanics for peak efficiency.
Core Highlights:
Automated substrate handling, vision alignment, and testing
Dual cassette capacity, holding 25 units per rack
Advanced pre-alignment and wafer sensing
Adaptable for high voltage testing exceeding 5kV
Available thermal chuck integration
Proprietary monitoring and control interface
Use Cases: high-scale manufacturing, GaN, GaAs, saw frames, thin substrate testing.
Extended Options: Pegasus™ A200D for automated dual-sided probing workflows.
200mm & 300mm – semi-automatic production probers
A cost-effective solution for rapid analysis of whole or segmented wafers up to 300mm. The S200 model accommodates up to 200mm, while the S300 supports up to 300mm. Both devices utilize the same flexible architecture and equipment options.
Core Highlights:
High-speed testing up to 100mm/sec
Semi-automated dual-point alignment
Dynamic profiling utilizing SSTS probe technology
Seamless blending of cameras and external analytics
TTL, Ethernet, RS232 and IEEE 488 connectivity
Scalable, field-updatable construction
Use Cases: general production, small-batch testing, design audits, root cause analysis, LEDs, MEMS, and discrete components.
Extended Options: 200mm variant for semi-automated dual-sided testing.
Double-sided probing
Our dual-sided testing systems facilitate measurements at the wafer level that are typically restricted to finalized packages—offering a streamlined and high-precision method to validate complex power electronics.
We design and build custom probe cards specifically for the Automated and Semi-Automated 200mm dual-sided systems. Utilizing epoxy-based PCBs with a maximum of 18 pins, the top and bottom assemblies are synchronized via dowel alignment for perfect simultaneous contact.