Cantilever Probe Cards
We engineer and produce cantilever probe cards for diverse semiconductor testing needs. Assembled locally with epoxy and blade methods, each card adheres to your precise needs, spanning from standard designs to fully customized builds.
Our design workflow is enhanced by proprietary software, guaranteeing high-grade results from start to finish. We integrate client files in formats such as .stl, .stp, .dwg, .dxf, and .grb.
Every delivered card is supported by our agile maintenance and restoration unit.
What we build
Epoxy and blade cards, low leakage solutions, high voltage and high current models (offering up to 10kV and 200A), extreme thermal units (–271°C to +300°C), plus dual-sided and bespoke setups.
Testing targets include power semiconductors, MOSFETs, IGBTs, LED arrays, MEMS, flip chips, ceramic bases, optical components, memory slots, logic gates and RF tech.
Technical specifications
- Thermal limits: –271°C (2 Kelvin) to +300°C
- Voltage up to 10kV, current exceeding 200A
- Low leakage optimized for the femtoamp (fA) scale
- Tip materials: tungsten, tungsten rhenium, copper, palladium
- Superior precision alignment and surface planarity
- Maintained contact resistance and durable tip life