Prober Analysis Systems
Our specialized probe stations facilitate in-depth failure analysis and device characterization. We provide manual or semi-automatic systems designed to support wafers measuring up to 300mm in diameter.
Each unit is fully customizable with various add-ons such as manipulators, thermal chucks, and optics. These scalable platforms are engineered to evolve alongside your specific testing needs through seamless future upgrades.
Automated 200mm and 300mm Probing Solutions
Experience a versatile semi-automatic environment optimized for 200mm or 300mm wafers. Ideal for RF, high voltage, and low leakage tasks, this platform operates across a -60°C to +400°C range.
Key features:
- Comprehensive wafer support
- Manual or motorized manipulators
- Cantilever card compatibility
- Advanced microscope mounts
- Software for automated routines
- Laser marking technology
High Voltage Semi-Automatic 200mm-HV Platform
Engineered for power semiconductor evaluation, this system ensures precise low contact resistance at high currents while prioritizing safety.
Key features:
- High current DC and pulsed probing
- Kelvin sensing technology
- Specialized reverse side contact
- High voltage safety isolation
- Thin wafer handling precision
- Seamless test instrument integration
Manual 200mm & 300mm Probing Stations
Dependable manual platforms for 200mm and 300mm wafers offer a cost-effective route for process verification and analysis.
Key features:
- Supports full or partial wafers
- Thermal range: -60°C to +400°C
- Fine-tuned front-facing controls
- Custom environmental enclosures
- Fits cantilever and replacement probes
Basics Manual Probing Unit
A streamlined manual prober for wafers up to 200mm, designed for ease of use and future scalability through modular upgrades.
Key features:
- 200mm maximum wafer support
- Precise XY stage and rotation
- Supports thermal chuck systems
- Flexible power optics options
- Integrated fast probing mode