Cantilever Probe Cards
We design and manufacture cantilever probe cards for a wide range of semiconductor test applications. Built in-house using epoxy and blade technologies, every card is made to your specification – standard configurations or fully bespoke.
Our probe card design process is supported by in-house developed software, ensuring consistent quality from concept through to completion. We accept customer designs in a wide range of file formats including .stl, .stp, .dwg, .dxf and .grb.
All probe cards are backed by a fast maintenance and repair service.
What we build
Epoxy probe cards, blade probe cards, low leakage probe cards, high voltage and high current cards (up to 10kV and 200A), extreme temperature cards (–271°C to +300°C), double-sided probing cards and custom configurations.
Applications include power semiconductors, MOSFETs and IGBTs, displays, LEDs, MEMS, flip chip, ceramic substrates, optical, memory, logic and RF devices.
Technical specifications
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Temperature range: –271°C (2 Kelvin) to +300°C
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High voltage to 10kV, high current to 200A and beyond
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Low leakage to femtoamp (fA) range
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Needle materials: tungsten, tungsten rhenium, beryllium copper, palladium alloy
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High precision alignment and excellent planarity
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Stable contact resistance and low tip wear
Your own designs
If you are looking to build or maintain your own probe cards, we also supply probe card manufacturing equipment, PCBs and a full range of needle holder assemblies.